• DocumentCode
    2780027
  • Title

    Using thin films as debris shields for laser micro-machining and high energy laser target interactions

  • Author

    Schwarz, Jens ; Kimmel, Mark ; Rambo, Patrick ; Atherton, Briggs

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    2009
  • fDate
    14-19 June 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Target debris has long been a problem when using low f-number optics for laser micro-machining applications or high energy laser target interactions. A debris shield can be used to protect the final focusing optics from damage. Therefore we have started to investigate the optical properties of various thin films such as Nitrocellulose, Mylar, and Polyimide with respect to their application as laser debris shields. Studies on optical and spectral transmission quality, absorption, stress induced birefringence, and damage threshold (short and long pulse) have been performed. For high energy, large aperture lasers, scalability up to 43 cm diameter has been demonstrated. Such large debris shields have been successfully used at Sandia´s 100 TW laser system.
  • Keywords
    birefringence; laser beam effects; laser beam machining; laser beams; micromachining; optical focusing; shielding; thin films; Sandia laser system; damage threshold; debris shields; high energy laser target interactions; large aperture laser; laser focusing; laser micromachining; low f-number optics; power 100 TW; spectral transmission quality; stress induced birefringence; thin films; Absorption; Apertures; Birefringence; Laser applications; Optical films; Optical pulses; Polyimides; Protection; Stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4244-4079-5
  • Electronic_ISBN
    978-1-4244-4080-1
  • Type

    conf

  • DOI
    10.1109/CLEOE-EQEC.2009.5191778
  • Filename
    5191778