Application of neural networks and genetic algorithms to RF and wireless packaging

Author

Mittra, R. ; Suntives, A. ; Hossain, M.S. ; Ma, Ji-Fu ; Veremey, V.

Author_Institution

Electromagn. Commun. Lab., Pennsylvania State Univ., University Park, PA, USA

fYear

2000

fDate

2000

Firstpage

151

Lastpage

154

Abstract

Conventional approaches to design of RF and wireless packages, which require both simulation and optimization of a large number of passive and active circuits, is a very time consuming process; hence, the CPU time required to carry out virtual prototyping of these circuits can be unacceptably long. This paper presents a neural-network-based approach for design of these packages in a numerically efficient manner

Keywords

active networks; circuit CAD; circuit optimisation; circuit simulation; genetic algorithms; microwave circuits; neural nets; packaging; passive networks; rapid prototyping (industrial); CPU time; RF packaging; active circuits; genetic algorithms; neural networks; neural-network-based approach; numerical efficiency; optimization; package design; passive circuits; simulation; virtual prototyping; wireless packaging; Artificial neural networks; Circuit simulation; Design optimization; Genetic algorithms; Microstrip; Neural networks; Packaging; Passive circuits; Radio frequency; Scattering parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895516

Filename

895516