DocumentCode
2783064
Title
Wire-bonding machine optimization using Taguchi method
Author
Saint-Martin, X. ; Yuan Chollet
Author_Institution
BULL S.A.
fYear
1992
fDate
1992
Firstpage
74
Lastpage
83
Keywords
Bonding forces; Ceramics; Costs; Magnetic heads; Optimization methods; Packaging machines; Reproducibility of results; Very large scale integration; Wafer bonding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763397
Filename
763397
Link To Document