DocumentCode

2783300

Title

Equipment selecmon for tape automated bonding (TAB)

Author

Miller, Michael C.

Author_Institution

Hewlett Packard

fYear

1992

fDate

1992

Firstpage

205

Lastpage

212

Keywords

Bonding processes; Conductive adhesives; Feeds; Gravity; Manufacturing; Packaging; Plastics; Protection; Prototypes; Virtual reality;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International

Print_ISBN

0-7803-0629-5

Type

conf

DOI

10.1109/IEMT.1992.763412

Filename

763412