DocumentCode
2783353
Title
Hardness reduction of Au bumps for tab interconnections
Author
Baggerman, A.F.J. ; Kessels, F.J.H.
Author_Institution
Philips Centre For Manufacturing Technology
fYear
1992
fDate
1992
Firstpage
229
Lastpage
236
Keywords
Annealing; Artificial intelligence; Bonding forces; Gold; Integrated circuit interconnections; Manufacturing automation; Metallization; Resists; Temperature; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763415
Filename
763415
Link To Document