DocumentCode
2783387
Title
Comparison of SMT, COB, and MCM technologies on a 68000 CPU
Author
Miet, J.M. ; Potage, J.
Author_Institution
Thomson-CSF
fYear
1992
fDate
1992
Firstpage
245
Lastpage
252
Keywords
Assembly; Central Processing Unit; Cost function; Data processing; Integrated circuit packaging; Lead; Multichip modules; Nonhomogeneous media; Packaging machines; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763417
Filename
763417
Link To Document