DocumentCode
2783513
Title
Effect of Scratch Stress on the Surface Hardness and Inner Structures of a Capacitive Fingerprint Sensor LSI
Author
Shimoyama, N. ; Shigematsu, S. ; Morimura, H. ; Shimamura, T. ; Kumazaki, T. ; Nakanishi, M. ; Ishii, H. ; Machida, K.
Author_Institution
NTT Microsystem Integration Labs., NTT Corp., Kanagawa
fYear
2007
fDate
15-19 April 2007
Firstpage
412
Lastpage
416
Abstract
The authors performed a scratch test in which a weighted needle applies scratch stress to the surface of a capacitive fingerprint sensor large scale integration (LSI), which has a grounded wall (GND wall) structure where each sensor plate is surrounded by a lattice-like wall. The scratch stress degrades not only the sensor´s surface but also the metal interlayer. Increasing the thickness of the surface passivation film and that of the interlayer reduce the degradation of the surface and inner structures. To confirm the influence of thick passivation film on the electrostatic discharge (ESD) hardness and the intensity of sensing of the fingerprint sensor LSI, the authors performed an air discharge test and fingerprint identification. The tests show that a thick passivation film and a thick interlayer are effective in preventing scratch stress with ESD hardness and the intensity of sensing of the fingerprint sensor LSI.
Keywords
capacitive sensors; electronic equipment testing; electrostatic discharge; fingerprint identification; large scale integration; stress effects; thick film sensors; air discharge test; capacitive fingerprint sensor LSI; electrostatic discharge; fingerprint identification; metal interlayer; scratch stress; scratch test; surface hardness; surface passivation film; thick passivation film; Capacitive sensors; Degradation; Electrostatic discharge; Fingerprint recognition; Large scale integration; Passivation; Performance evaluation; Stress; Surface discharges; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369925
Filename
4227666
Link To Document