• DocumentCode
    2783513
  • Title

    Effect of Scratch Stress on the Surface Hardness and Inner Structures of a Capacitive Fingerprint Sensor LSI

  • Author

    Shimoyama, N. ; Shigematsu, S. ; Morimura, H. ; Shimamura, T. ; Kumazaki, T. ; Nakanishi, M. ; Ishii, H. ; Machida, K.

  • Author_Institution
    NTT Microsystem Integration Labs., NTT Corp., Kanagawa
  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    412
  • Lastpage
    416
  • Abstract
    The authors performed a scratch test in which a weighted needle applies scratch stress to the surface of a capacitive fingerprint sensor large scale integration (LSI), which has a grounded wall (GND wall) structure where each sensor plate is surrounded by a lattice-like wall. The scratch stress degrades not only the sensor´s surface but also the metal interlayer. Increasing the thickness of the surface passivation film and that of the interlayer reduce the degradation of the surface and inner structures. To confirm the influence of thick passivation film on the electrostatic discharge (ESD) hardness and the intensity of sensing of the fingerprint sensor LSI, the authors performed an air discharge test and fingerprint identification. The tests show that a thick passivation film and a thick interlayer are effective in preventing scratch stress with ESD hardness and the intensity of sensing of the fingerprint sensor LSI.
  • Keywords
    capacitive sensors; electronic equipment testing; electrostatic discharge; fingerprint identification; large scale integration; stress effects; thick film sensors; air discharge test; capacitive fingerprint sensor LSI; electrostatic discharge; fingerprint identification; metal interlayer; scratch stress; scratch test; surface hardness; surface passivation film; thick passivation film; Capacitive sensors; Degradation; Electrostatic discharge; Fingerprint recognition; Large scale integration; Passivation; Performance evaluation; Stress; Surface discharges; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369925
  • Filename
    4227666