• DocumentCode
    2783589
  • Title

    Time Dependent Vccmin Degradation of SRAM Fabricated with High-k Gate Dielectrics

  • Author

    Lin, J.C. ; Oates, A.S. ; Yu, C.H.

  • Author_Institution
    Taiwan Semicond. Manuf. Co. Ltd., Hsinchu
  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    439
  • Lastpage
    444
  • Abstract
    The paper presents the results of simulations of voltage-induced V ccmin drift of SRAMs fabricated with high-k gate dielectrics. The authors show that high-k based SRAMs are fundamentally more susceptible to Vccmin stability problems because PMOS NBTI and NMOS PBTI lead to an additive degradation in the bit-cell read voltage. Given the differing time dependences of the NBTI and PBTI phenomena, the drift of Vccmin is enhanced at much earlier times compared to SRAMs that have SiO2 gate dielectric only devices. Maintaining Vccmin stability presents a significantly greater challenge for high-k gate dielectrics compared to SiO2
  • Keywords
    MOS integrated circuits; SRAM chips; high-k dielectric thin films; integrated circuit reliability; silicon compounds; stability; NMOS PBTI; PMOS NBTI; SRAM; SiO2; high-k gate dielectrics; stability problems; time dependent degradation; voltage-induced drift; Degradation; High K dielectric materials; High-K gate dielectrics; Lead; MOS devices; Niobium compounds; Random access memory; Stability; Titanium compounds; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369930
  • Filename
    4227671