• DocumentCode
    2786086
  • Title

    Failure Analysis Of Power Modules; A Look At The Packaging And Reliability Of Large IGBTs

  • Author

    De Lambilly, H. ; Keser, H.

  • Author_Institution
    Asea Brown Boveri Corporate Research Center, Baden, Switzerland.
  • fYear
    1992
  • fDate
    28-30 Sep 1992
  • Firstpage
    366
  • Lastpage
    370
  • Keywords
    Assembly; Cooling; Failure analysis; Insulated gate bipolar transistors; Multichip modules; Packaging; Temperature measurement; Testing; Thermal resistance; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
  • Print_ISBN
    0-7803-0755-0
  • Type

    conf

  • DOI
    10.1109/IEMT.1992.639922
  • Filename
    639922
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2786086