• DocumentCode
    2788875
  • Title

    A wafer scale optical bus interconnection prototype

  • Author

    Jenevein, Roy M. ; Campbell, Joe C.

  • Author_Institution
    Texas Univ., Austin, TX, USA
  • fYear
    1992
  • fDate
    22-24 Jan 1992
  • Firstpage
    182
  • Lastpage
    191
  • Abstract
    Prototypes of a wafer wide optical bus interconnection technology are described. By optically coupling subsystems on the wafer, faults normally found in electrically based interconnection topologies are avoided. Wire buses are more prone to errors than waveguides due to the nature of the material involved and requirements for connectivity. This is accomplished through the incorporation of a planar waveguide which couples emitter/detector pairs. This waveguide supports an omnidirectional emission from an optical diode to all receivers on the wafer. The authors emphasize the emitter properties of the light emitting diode (LED) and its coupling to the waveguide. Details of the current prototypes are given along with data on the output of the waveguide. A photograph of the light emitted from the edge of the waveguide along with analysis and waveforms is included. The 5-micron waveguide provided improved coupling and quite flat output along the edge as compared to a 0.3-micron device. Current work utilizes a single wavelength source from a LED transmitting at 1.4 Gbit/second
  • Keywords
    VLSI; integrated optoelectronics; optical interconnections; optical waveguides; 0.3 micron; 1.4 Gbit/s; 5 micron; LED; WSI; broadcasting optical bus; emitter/detector pairs; light emitting diode; omnidirectional emission; optical diode; planar waveguide; prototype; single wavelength source; wafer scale integration; wafer scale optical bus interconnection; wafer wide optical bus interconnection; Light emitting diodes; Optical coupling; Optical interconnections; Optical materials; Optical receivers; Optical waveguides; Prototypes; Stimulated emission; Topology; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1992. Proceedings., [4th] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-2482-5
  • Type

    conf

  • DOI
    10.1109/ICWSI.1992.171810
  • Filename
    171810