DocumentCode
2790837
Title
Effects of global interconnect optimizations on performance estimation of deep submicron design
Author
Yu Cao ; Chenming Hu ; Xuejue Huang ; Kahng, A.B. ; Muddu, S. ; Stroobandt, D. ; Sylvester, D.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
2000
fDate
5-9 Nov. 2000
Firstpage
56
Lastpage
61
Abstract
In this paper, we quantify the impact of global interconnect optimization techniques that address such design objectives as delay, peak noise, delay uncertainty due to noise, power, and cost. In doing so, we develop a new system-performance simulation model as a set of studies within the MARCO GSRC Technology Extrapolation (GTX) system. We model a typical point-to-point global interconnect and focus on accurate assessment of both circuit and design technology with respect to such issues as inductance, signal line shielding, dynamic delay, buffer placement uncertainty and repeater staggering. We demonstrate, for example, that optimal wire sizing models need to consider inductive effects-and that use of more accurate (-1,3) worst-case capacitive coupling noise switch factors substantially increases peak noise estimates compared to traditional (0,2) bounds. We also find that optimal repeater sizes are significantly smaller than conventional models would suggest, especially when considering energy-delay issues.
Keywords
VLSI; circuit CAD; digital simulation; extrapolation; optimisation; MARCO GSRC technology extrapolation system; buffer placement uncertainty; deep submicron design; delay; delay uncertainty; dynamic delay; global interconnect optimizations; optimal repeater sizes; peak noise; performance estimation; point-to-point global interconnect; signal line shielding; system-performance simulation model; Circuit noise; Cost function; Delay; Design optimization; Integrated circuit interconnections; Power system interconnection; Power system modeling; Repeaters; Switches; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2000. ICCAD-2000. IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
ISSN
1092-3152
Print_ISBN
0-7803-6445-7
Type
conf
DOI
10.1109/ICCAD.2000.896451
Filename
896451
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