DocumentCode
2791558
Title
Improving SRAM Vmin and yield by using variation-aware BTI stress
Author
Wang, Jiajing ; Nalam, Satyanand ; Qi, Zhenyu Jerry ; Mann, Randy W. ; Stan, Mircea ; Calhoun, Benton H.
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
2010
fDate
19-22 Sept. 2010
Firstpage
1
Lastpage
4
Abstract
We propose a novel method that exploits BTI to partially offset variation and thus improve SRAM Vmin and yield. We show correlation between a bitcell´s power-up state and its static noise margin. By applying stress with periodic re-power-up, device mismatch can be compensated by BTI induced changes. The proposed method has no extra design and area cost. It can be applied during burn-in test to offset manufacturing variation and/or used during the lifetime of the chip to offset variation from real-time aging and hence continue to improve the margins. Simulations in 45nm show that write, read, and hold Vmin at 6σ can be reduced by 128, 75, and 91 mV, respectively. Measurements from a 16Kb 45nm SRAM demonstrate the improvement of Vmin and yield.
Keywords
SRAM chips; integrated circuit yield; SRAM Vmin; SRAM yield; bitcell power-up state; burn-in test; device mismatch; manufacturing variation; real-time aging; static noise margin; variation-aware BTI stress; Circuit stability; Noise; Random access memory; Semiconductor device measurement; Stability analysis; Stress; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference (CICC), 2010 IEEE
Conference_Location
San Jose, CA
ISSN
0886-5930
Print_ISBN
978-1-4244-5758-8
Type
conf
DOI
10.1109/CICC.2010.5617631
Filename
5617631
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