• DocumentCode
    2791558
  • Title

    Improving SRAM Vmin and yield by using variation-aware BTI stress

  • Author

    Wang, Jiajing ; Nalam, Satyanand ; Qi, Zhenyu Jerry ; Mann, Randy W. ; Stan, Mircea ; Calhoun, Benton H.

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    2010
  • fDate
    19-22 Sept. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We propose a novel method that exploits BTI to partially offset variation and thus improve SRAM Vmin and yield. We show correlation between a bitcell´s power-up state and its static noise margin. By applying stress with periodic re-power-up, device mismatch can be compensated by BTI induced changes. The proposed method has no extra design and area cost. It can be applied during burn-in test to offset manufacturing variation and/or used during the lifetime of the chip to offset variation from real-time aging and hence continue to improve the margins. Simulations in 45nm show that write, read, and hold Vmin at 6σ can be reduced by 128, 75, and 91 mV, respectively. Measurements from a 16Kb 45nm SRAM demonstrate the improvement of Vmin and yield.
  • Keywords
    SRAM chips; integrated circuit yield; SRAM Vmin; SRAM yield; bitcell power-up state; burn-in test; device mismatch; manufacturing variation; real-time aging; static noise margin; variation-aware BTI stress; Circuit stability; Noise; Random access memory; Semiconductor device measurement; Stability analysis; Stress; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2010 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4244-5758-8
  • Type

    conf

  • DOI
    10.1109/CICC.2010.5617631
  • Filename
    5617631