Research on simulation for fracture process of T-type adhesive bonded joint under peel load

In this paper, T-type adhesively bonded joint peel test is served as simulation object, to explore a efficiently approach to model T-type adhesive bonded joint and to predict it´s failure. Firstly, T-type adhesively bonded joint peel tests were conducted. Base on the measured data, load-displacement curve were plot. Secondly, on the basis of DYNA, a finite element model of T-type adhesive bonded joint was built. Works focus on how to use adhesive material model (MAT169)to model adhesive, and how to select the fracture parameters in model. Finally, this simulation approach was be validated by tests. The results show that adhesive material model (MAT169)can be used to model adhesive fracture and adhesive bonded joint separation efficiently. Through examine constitutive response of one solid element with MAT169, fracture parameters can be determined after some attempts and comparisons. Connecting between shell element and solid element can be implemented by increasing adhesive layer´s thickness. It inevitably results in error which can be eliminated by adjusting elastic modulus of adhesive. However, more research works are needed to be done for predicting adhesive bonded joint´s initial peel force.