Material handling automation for wafer fabrication facilities

Author

Pillai, Devadas

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1990

fDate

1-3 Oct 1990

Firstpage

277

Lastpage

286

Abstract

A detailed analysis of the needs and requirements for successfully designing and implementing automated material handling and control systems in wafer fabs is presented. In addition, potential system configurations and options for both interbay and intrabay material handling designs are discussed. The control system requirements, the importance of total systems integration, and the role of the skilled production operator are addressed. Constant references are made to material movement dynamics-a critical factor that affects the performance and acceptance of the system

Keywords

computerised materials handling; manufacturing computer control; semiconductor device manufacture; automated material handling; control systems; interbay material handling; intrabay material handling; material movement dynamics; skilled production operator; system configurations; total systems integration; wafer fabrication facilities; Automatic control; Contamination; Control systems; Fabrication; Lead compounds; Manufacturing automation; Materials handling; Materials reliability; Production facilities; Semiconductor device manufacture;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Conference_Location

Washington, DC

Type

conf

DOI

10.1109/IEMT9.1990.115019

Filename

115019