DocumentCode
2793936
Title
Technical aspects of interfacial phenomena in solid insulating systems
Author
Kärner, H.C. ; Ieda, Mirai
Author_Institution
Tech. Univ. of Braunschweig, Germany
fYear
1991
fDate
8-12 Jul 1991
Firstpage
592
Abstract
HV insulation systems are often composed of different insulating materials. In the contact areas between these materials (interfaces) interfacing polarization may occur, resulting in an increase of both permittivity and loss tangent and, consequently, of dielectric losses. By the interaction of humidity such interfacial phenomena may be enhanced. Other important characteristics of insulating systems such as the treeing strength and the breakdown strength are also lowered by interfaces, especially when humidity has been adsorbed. Microscopic and macroscopic, internal and external interfaces are defined for composite insulation systems. Interfacial phenomena in such systems, for instance made out of fiber glass-reinforced polymeric materials, are described both under dry conditions and in the presence of water. It is demonstrated that the hydrophobic properties of materials improve the dielectric characteristics; this is true for bulk and surface properties
Keywords
composite insulating materials; dielectric losses; dielectric properties of solids; electric breakdown of solids; high-voltage engineering; humidity; insulation; interface phenomena; permittivity; HV insulation systems; breakdown strength; bulk properties; composite insulation systems; contact areas; dielectric characteristics; dielectric losses; dry conditions; fiber glass-reinforced polymeric materials; humidity; hydrophobic properties; interfacial phenomena; interfacing polarization; loss tangent; moist conditions; permittivity; solid insulating systems; surface properties; treeing strength; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Humidity; Microscopy; Permittivity; Polarization; Solids; Trees - insulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location
Tokyo
Print_ISBN
0-87942-568-7
Type
conf
DOI
10.1109/ICPADM.1991.172128
Filename
172128
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