• DocumentCode
    2795507
  • Title

    Modification of the microstructure of polyethylene in ionic solution under electrical field

  • Author

    Martinez, J.J. ; Lacabanne, C. ; Boulouz, M. ; Mayoux, C.

  • Author_Institution
    Toulouse Univ., France
  • fYear
    1991
  • fDate
    8-12 Jul 1991
  • Firstpage
    883
  • Abstract
    The influence of ageing on low density polyethylene (LDPE) in various ionic solutions and under electric field has been investigated by thermally stimulated creep (TSCr), which makes it possible to characterize the amorphous and paracrystalline phases. The TSCr spectrum of reference LDPE shows the existence of three mechanical retardation modes labeled α, β, and γ in the order of decreasing temperatures. The α mode has been associated with mechanisms involving the paracrystalline phase while the β and γ modes have been attributed to the amorphous phase. The experimental data deduced from the analysis of TSCr spectra have been plotted on a compensation diagram: they define the `structure´ of the disordered phases of reference LDPE. The comparative study of LDPE samples aged in various environmental conditions under electric field shows that the paracrystalline phase is destructured, and that a plasticization process takes place
  • Keywords
    ageing; anelastic relaxation; creep; organic insulating materials; polymer structure; polymers; thermally stimulated currents; LDPE; ageing; amorphous phase; compensation diagram; electrical field; environmental conditions; ionic solution; mechanical retardation modes; microstructure; paracrystalline phases; plasticization process; polyethylene; thermally stimulated creep; Aging; Amorphous materials; Creep; Laboratories; Microstructure; Polyethylene; Polymers; Solids; Temperature; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-87942-568-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.1991.172210
  • Filename
    172210