DocumentCode
2796761
Title
1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)
fYear
1998
fDate
March 31 1998-April 2 1998
Keywords
reliability; MEMS; assembly; compound semiconductors; device processes; dielectrics; electrostatic discharge; failure analysis; hot carriers; interconnet; latchup; metallisation; optoelectronics; packaging; reliability physics;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
Conference_Location
Reno, NV, USA
Print_ISBN
0-7803-4400-6
Type
conf
DOI
10.1109/RELPHY.1998.670434
Filename
670434
Link To Document