• DocumentCode
    2796762
  • Title

    Qualifying Methods of Conformal Coatings used on Assembled Printed Circuit Boards

  • Author

    Medgyes, Bálint Károly ; Ripka, Gábor

  • Author_Institution
    Budapest Univ. of Technol. & Econ., Budapest
  • fYear
    2007
  • fDate
    9-13 May 2007
  • Firstpage
    429
  • Lastpage
    433
  • Abstract
    Increased protection of printed circuit boards (PCB) is required in some fields of the electronic industry, because of the diverse climatic circumstances in which these devices are used. This increased protection is reached by the use of different conformal coatings. The article summarizes the temperature-related and the electric parameters of these materials, and classifies them from the viewpoint of their chemical resistance. Furthermore, it demonstrates the influences of two environment tests (thermal shock and thermal humidity tests) on the insulation resistance of two coatings (Dow Corning: 3-1953 silicone elastomer [1] and PETERS:TWIN-CURE DSL 1600 E-FLZ polyurethane-polyacrilate copolymer [2]), in function of the duration of exposing. After that, it demonstrates the formation of polycondensational cross-linking coatings in function of time and layer thickness, and it touches on the measurement of the dielectric strength as well.
  • Keywords
    conformal coatings; electric strength; printed circuit testing; PCB protection; assembled printed circuit board; chemical resistance; conformal coating; dielectric strength measurement; diverse climatic circumstance; electronic industry; insulation resistance; polycondensational cross-linking coating; Assembly; Chemicals; Coatings; Electric resistance; Electric shock; Electronics industry; Insulation testing; Printed circuits; Protection; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 30th International Spring Seminar on
  • Conference_Location
    Cluj-Napoca
  • Print_ISBN
    987-1-4244-1218-1
  • Electronic_ISBN
    987-1-4244-1218-1
  • Type

    conf

  • DOI
    10.1109/ISSE.2007.4432894
  • Filename
    4432894