DocumentCode
2802470
Title
Thermal analysis of a substrate with power dissipation in the vias
Author
Brewster, Robert A. ; Sherif, Raed A.
Author_Institution
IBM East Fishkill, Hopewell Junction, NY, USA
fYear
1992
fDate
3-5 Feb 1992
Firstpage
69
Lastpage
75
Abstract
The authors present an analysis of the temperature field resulting from the Joule heating in a metal wire surrounded by a non-heat-generating (electrically insulating) material. Exact analytical solutions are given for when the heat generation rate is constant and linearly dependent on the temperature. Asymptotic solutions are given for arbitrarily temperature-dependent heat generation, when the insulating material thermal conductivity is much less than the thermal conductivity of the wire. A numerical example of practical interest is considered. It is shown that neglecting the Joule heating in the wires can result in significant underestimation of the temperature. The effect of temperature on the electrical resistivity of the wire is shown to be negligible. The phenomenon of thermal runaway is also examined using stability theory and is shown to be unimportant in practical circumstances
Keywords
packaging; substrates; temperature distribution; thermal analysis; Joule heating; electronic package; heat generation rate; insulating material thermal conductivity; metal wire; numerical example; power dissipation; substrate; temperature field; thermal analysis; thermal runaway; vias; Cable insulation; Conducting materials; Dielectrics and electrical insulation; Electric resistance; Inorganic materials; Power dissipation; Resistance heating; Temperature dependence; Thermal conductivity; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE
Conference_Location
Austin, TX
Print_ISBN
0-7803-0500-0
Type
conf
DOI
10.1109/STHERM.1992.172853
Filename
172853
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