• DocumentCode
    2804796
  • Title

    Analytic modeling of loss and cross-coupling in capacitive micromachined ultrasonic transducers

  • Author

    Bozkurt, Ayhan ; Degertekin, F.L. ; Atalar, Abdullah ; Khuri-Yakub, B.T.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
  • Volume
    2
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    1025
  • Abstract
    The structural loss mechanism of capacitive micromachined ultrasonic transducer (cMUT) is investigated using finite element analysis and the normal mode theory. A single micromachined transducer membrane on an infinite silicon substrate is simulated by incorporating absorbing boundary conditions in the finite element method. This enables direct evaluation of the mechanical impedance of the membrane. Furthermore, the field distribution along the thickness of the silicon substrate due to outward radiating wave modes is obtained. The normal mode theory is applied to extract the contributions of different wave modes to the complicated field distributions. It is found that, the lowest order Lamb wave modes are responsible for the loss. Evaluation of absolute and relative power losses due to individual modes indicate that the lowest order anti-symmetric (A0) mode is the dominant radial mode in agreement with experimental measurements. The results of the analysis are used to derive a detailed equivalent circuit model of a cMUT with structural loss
  • Keywords
    dielectric losses; finite element analysis; micromechanical devices; ultrasonic transducers; absorbing boundary conditions; analytic modeling; capacitive micromachined ultrasonic transducers; complicated field distributions; cross-coupling; direct evaluation; equivalent circuit model; field distribution; finite element analysis; finite element method; infinite Si substrate; loss; lowest order Lamb wave modes; lowest order anti-symmetric mode; mechanical impedance; normal mode theory; single micromachined transducer membrane; wave modes; Analytical models; Biomembranes; Boundary conditions; Couplings; Finite element methods; Impedance; Laboratories; Micromachining; Silicon; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE
  • Conference_Location
    Sendai
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-4095-7
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1998.764979
  • Filename
    764979