A sensitivity equation method for molding processes

Author

Stanley, L.G.

Author_Institution

Dept. of Math. Sci., Montana State Univ., Bozeman, MT, USA

fYear

2000

fDate

2000

Firstpage

524

Lastpage

529

Abstract

Describes a sensitivity equation method for elliptic interface problems where the parameter of interest determines the spatial location of the interface. Elliptic differential equations of this type are often characterized by discontinuous coefficients and, in some instances, these equations may have discontinuous solutions or flux terms. The computational method constructed in the paper uses an iterative, non-overlapping domain decomposition algorithm. Preliminary results indicate that the algorithm works well under optimal conditions

Keywords

boundary-value problems; differential equations; elliptic equations; gradient methods; iterative methods; moulding; sensitivity; temperature distribution; discontinuous coefficients; elliptic differential equations; elliptic interface problems; iterative nonoverlapping domain decomposition algorithm; molding processes; optimal conditions; sensitivity equation method; spatial location; Boundary conditions; Conducting materials; Conductivity; Die casting; Differential equations; Filling; Partial differential equations; Shape; Steady-state; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Control Applications, 2000. Proceedings of the 2000 IEEE International Conference on

Conference_Location

Anchorage, AK

Print_ISBN

0-7803-6562-3

Type

conf

DOI

10.1109/CCA.2000.897478

Filename

897478