Increased feedback due to package mounting

Author

Aaen, Peter H. ; Plá, Jaime A. ; Balanis, Constantine A.

Author_Institution

Freescale Semicond. Inc., Tempe, AZ, USA

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

49

Lastpage

52

Abstract

The affects of a discontinuity in the ground plane created by a difference in package and PCB thickness is examined. The overall circuit affects for a packaged transistor, in which its thickness is different than the PCB thickness, were simulated with commercially available electromagnetic 2D and 3D CAD tools. It was determined from the simulation results, that the discontinuity creates an inductive feedback path around the package that affects circuit performance. The affect of the ground step discontinuity and its associated strong dependency of the source inductance on FET device´s common source gain have been highlighted.

Keywords

circuit analysis computing; electronics packaging; field effect transistors; printed circuits; FET device; PCB thickness; discontinuity; electromagnetic 2D/3D CAD tools; ground plane; inductive feedback path; package mounting; packaged transistor; Conductors; Feedback; Flanges; Microstrip; Microwave transistors; Packaging; Telephony; Testing; Transmission line discontinuities; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407543

Filename

1407543