Modeling of power distribution networks with retardation using the transmission matrix method

Author

Watanabe, Takayuki ; Srinivasan, Krishna ; Asai, Hideki ; Swaminathan, Madhavan

Author_Institution

Sch. of Adm. & Inf., Shizuoka Univ., Japan

fYear

2004

fDate

25-27 Oct. 2004

Firstpage

233

Lastpage

236

Abstract

This work describes the analysis of multilayered power distribution networks that include signal lines and vias. The signal lines are modeled as transmission lines, and vias are represented as not only self and mutual inductances but also include retardation currents. The structures have been analyzed using the transmission matrix method (TMM) in the frequency domain. Analysis using the TMM provides considerable savings in memory compared to SPICE.

Keywords

CMOS digital integrated circuits; distribution networks; frequency-domain analysis; inductance; integrated circuit modelling; power integrated circuits; power transmission lines; transmission line matrix methods; CMOS digital integrated circuits; SPICE; frequency domain analysis; integrated circuit modeling; memory savings; multilayered power distribution networks; mutual inductances; power integrated circuits; retardation currents; self inductances; signal lines; transmission lines; transmission matrix method; Admittance; Capacitors; Inductance; Packaging; Paramagnetic resonance; Power system modeling; Power systems; Power transmission lines; Transmission line matrix methods; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on

Print_ISBN

0-7803-8667-1

Type

conf

DOI

10.1109/EPEP.2004.1407595

Filename

1407595