• DocumentCode
    2807715
  • Title

    Bandwidth simulation for high speed memory package

  • Author

    Chen, Cheng-Pin ; Cheng, Jing-Hua ; Fan, Wen-Jeng ; Lin, Nan-Chun ; Su, Ting-Feng

  • Author_Institution
    Powertech Technol. Inc., Hsinchu
  • fYear
    2007
  • fDate
    1-3 Oct. 2007
  • Firstpage
    110
  • Lastpage
    113
  • Abstract
    This is a comparative study for varied type package performance. From the study, we are able to quantify the performance by parasitic parameter, bandwidth, voltage swing of Vref and skew simulation results.
  • Keywords
    memory architecture; random-access storage; Vref; bandwidth simulation; high speed memory package; parasitic parameters; skew simulation; voltage swing; Bandwidth; Bonding; Circuit simulation; Electromagnetic compatibility; Frequency; Gold; Lead; Packaging; SPICE; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-1636-3
  • Electronic_ISBN
    978-1-4244-1637-0
  • Type

    conf

  • DOI
    10.1109/IMPACT.2007.4433579
  • Filename
    4433579
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2807715