Lead-free process compatible no flow prepreg for rigid-flex PCB

As increasing functions are added to electronic products, the versatility for product design is required. Due to this reason, rigid-flex PCB has drawn attention for its significant progress and increasing demand. The key material to combine both rigid and flexible PCBs together is no flow prepreg. The main function for this material is to produce a reliable bonding layer between rigid and flexible materials. Therefore, study of material interface properties and behaviors is of crucial importance for no flow prepreg applications. A new no flow prepreg based on a phenolic-cured system has been developed. The newly developed material showed excellent heat resistance and reliability. The properties are superior to those of conventional dicy-cured system as characterized by thermal analyses and thermal shock tests.