• DocumentCode
    2816672
  • Title

    Active disassembly using shape memory polymers for the mobile phone industry

  • Author

    Chiodo, J D ; Billett, E.H. ; Harrison, D.J.

  • Author_Institution
    Brunel Univ., Uxbridge, UK
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    151
  • Lastpage
    156
  • Abstract
    This paper reports results the application of shape memory polymer (SMP) technology to the active disassembly of modern mobile phones. The smart material SMP of polyurethane (PU) composition was employed. Two different types of SMP fasteners were created for these experiments. With these smart material devices, it is possible for products to disassemble themselves at specific triggering temperatures at EoL. The two designs were compared for disassembly effectiveness. The disassembly technique is termed active disassembly using smart materials (ADSM), and has been successfully demonstrated on a variety of mobile phones. Whilst developed primarily as a universal disassembly technique, cost effectiveness and time performance is apparent. Heat sources of +90, +100 and a range of +67 to +120°C were employed to raise the releasable fasteners above their trigger temperatures: in the case of SMP this would be the glass transition temperature (Tg). The development of releasable fasteners and applications in electronic products is described
  • Keywords
    environmental factors; land mobile radio; polymers; radiotelephony; shape memory effects; telephone sets; 67 to 120 C; active disassembly; disassembly effectiveness; electronic products; fasteners; glass transition temperature; mobile phone industry; polyurethane composition; releasable fasteners; shape memory polymers; smart material; trigger temperatures; triggering temperatures; Assembly; Composite materials; Costs; Fasteners; Mobile handsets; Plastics industry; Polymers; Product design; Shape; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1999. ISEE -1999. Proceedings of the 1999 IEEE International Symposium on
  • Conference_Location
    Danvers, MA
  • Print_ISBN
    0-7803-5495-8
  • Type

    conf

  • DOI
    10.1109/ISEE.1999.765867
  • Filename
    765867