DocumentCode
2822051
Title
Electro-thermal simulation of MEMS elements
Author
Rencz, M. ; Székely, V. ; Poppe, A. ; Courtois, B.
Author_Institution
MicReD Ltd., Hungary
fYear
2003
fDate
5-7 May 2003
Firstpage
15
Lastpage
20
Abstract
In this paper we present a new algorithm, developed for the layout based electro-thermal simulation of integrated circuits and MEMS. The method uses simultaneous iteration of the thermal and electrical behavior. The general advantage of this method over simulator coupling is that, it is also suitable to cope with very fast changes. The usual drawback is however, that the thermal nodes have to be added to the nodes of the electrical network, rendering usually huge networks to be simulated. In our thermal modeling method the thermal system is represented by a matrix of Foster networks. The solution of these can be partly pre-calculated, partly separated from the solution of the electrical nodes, resulting in fast and accurate electro-thermal simulation. Case studies are presented to show the applicability of the method for the analysis of thermally operated MEMS elements. The results of the electro-thermal simulation of a realized MEMS electro-thermal converter show very good matching with the results measured on the structure.
Keywords
integrated circuit layout; integrated circuit modelling; micromechanical devices; Foster networks; electrical network; electrical nodes; electro-thermal converter; electro-thermal simulation; integrated circuits; iteration; thermal modeling method; thermal system; thermally operated MEMS elements; Circuit simulation; Circuit testing; Electronic packaging thermal management; Equations; Feedback circuits; Micromechanical devices; Relaxation methods; Temperature; Thermal force; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN
0-7803-7066-X
Type
conf
DOI
10.1109/DTIP.2003.1287001
Filename
1287001
Link To Document