Study and realisation of a micromechanical relay for use in a harsh environment

A novel out-of-plane actuated microrelay designed in order to be used in a harsh environment is reported. This microrelay consists in an Al/SiO₂ bimorph cantilever and a gold-to-gold electrical contact. This device switches through a combined electrostatic and thermal actuation. The manufacturing process allows the integration of these devices on standard IC (the Integrated circuit). An analytical model describing the combined electrical, thermal, and mechanical behavior of the cantilever beam is used to set appropriate geometrical parameters in order to improve reliability for use in a harsh environment. This paper presents the theory, the design, the fabrication process and the experimental results of this microrelay.