Bonding of polymer microstructures by UV irradiation and welding at low temperatures

Author

Truckenmüller, R. ; Henzi, P. ; Herrmann, D. ; Saile, V. ; Schomburg, W.K.

Author_Institution

Inst. fur Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Germany

fYear

2003

fDate

5-7 May 2003

Firstpage

265

Lastpage

267

Abstract

A new bonding process has been developed for polymer microstructures, especially of Polymethylmethacrylate (PMMA), which avoids the problems caused by using adhesives or solvents or applying high temperatures. It is based on photo degradation of polymers. Moulded PMMA microchannels and microspectrometer gratings were covered with PMMA plates by ultraviolet irradiation of the joining faces and subsequent welding at low temperatures. Because of the low thermal load, structure details even in the submicrometer range remain dimensionally stable during the bonding process.

Keywords

bonding processes; diffraction gratings; microchannel plates; optical polymers; polymer structure; ultraviolet radiation effects; welding; PMMA microchannels; PMMA plates; UV irradiation; bonding processes; microspectrometer gratings; photo degradation; polymer microstructure; polymers photo degradation; polymethylmethacrylate; ultraviolet irradiation; welding; Bonding processes; Gratings; Microchannel; Microstructure; Polymers; Solvents; Temperature; Thermal degradation; Thermal loading; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on

Print_ISBN

0-7803-7066-X

Type

conf

DOI

10.1109/DTIP.2003.1287049

Filename

1287049