• DocumentCode
    2823013
  • Title

    A new electroforming technology in aid of pressure for LIGA process

  • Author

    Hsiharng Yang ; Tsai, Tsung-Shuin ; Chein, Reiyu ; Chan, Chia-Hua ; Wu, Jen-Chin

  • Author_Institution
    Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
  • fYear
    2003
  • fDate
    5-7 May 2003
  • Firstpage
    275
  • Lastpage
    280
  • Abstract
    New microelectroforming technique using air pressure assistance in the electrolyte is introduced. The theoretical model and experiments are reported in this paper. It shows that the pressurized electrolyte reduces hydrogen bubbles formation and defects existing on substrate surface. High pressure in the electrolyte limits bubbles formation in electroforming. It also results in good throwing power from the experimental samples observation. The edges of the electroformed workpiece using the pressurized method are smoother than the conventional electroforming. Metallurgical grains are finer when high pressures applied in the electrolyte based on SEM micrographs. The pressurized electroforming can increase the allowable current density, which can shorten plating time in the LIGA process. High growth rate due to a large applied current density results in large grains of electroforming microstructures, but the surface morphology of the pressurized electroforming is also improved comparing with the conventional method.
  • Keywords
    LIGA; crystal microstructure; micromechanical devices; scanning electron microscopy; surface morphology; LIGA process; SEM; electroforming microstructure; electrolyte limits bubbles formation; hydrogen bubbles formation; lithography galvanoformung abformung; metallurgical grains; microelectroforming technique; pressurized method; substrate surface; surface morphology; Cathodes; Chemical processes; Chemical products; Current density; Electrons; Hydrogen; Microstructure; Nickel; Stress; Surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
  • Print_ISBN
    0-7803-7066-X
  • Type

    conf

  • DOI
    10.1109/DTIP.2003.1287052
  • Filename
    1287052