DocumentCode
2827937
Title
Modeling of 3D packages using EM simulators
Author
Kelander, Ilkka ; Arslan, Ali Nadir ; Hyvönen, Lassi ; Kangasmaa, Seppo
Author_Institution
Nokia Corp., Helsinki, Finland
fYear
2004
fDate
9-12 May 2004
Firstpage
183
Lastpage
186
Abstract
This paper discusses the modeling of 3D electronic packages. A 3D model of a stacked die package solution is built and analyzed in a 3D electromagnetic (EM) simulation tool, and a lumped element RLC equivalent model is extracted. The challenges and possibilities of EM simulation are discussed. The parasitic components of the package are studied by analyzing the 3D model by parts. Strategies in specifying a Spice net list of the package model and its feasibility in circuit simulations are considered.
Keywords
circuit simulation; equivalent circuits; integrated circuit modelling; integrated circuit packaging; lumped parameter networks; 3D electromagnetic simulation tool; 3D electronic packages; 3D package modeling; EM simulators; Spice net list; circuit simulations; lumped element RLC equivalent model; parasitic components; stacked die package solution; Analytical models; Circuit simulation; Computational modeling; Computer simulation; Electromagnetic analysis; Electromagnetic modeling; Electronics packaging; Equivalent circuits; Mathematical model; RLC circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN
0-7803-8470-9
Type
conf
DOI
10.1109/SPI.2004.1409046
Filename
1409046
Link To Document