• DocumentCode
    2831781
  • Title

    Electric field effect on thermopower in cylindrical microwires

  • Author

    Kantser, V. ; Dashevsky, Z. ; Scherrer, H. ; Meglei, D. ; Dantu, M.

  • Author_Institution
    LISES Inst. of Appl. Phys. ASAI, Chisinau, Moldova
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    350
  • Lastpage
    354
  • Abstract
    The electric field effect (EFE) in a coaxial cylindrical capacitor configuration was used to study the modification of transport and thermoelectric properties of the semiconductors PbTe and Bi2Te3 as glass coated microwires. Theoretical analysis of microwire EFE was done on the basis of Poisson equation in cylindrical geometry with corresponding boundary conditions. The radial dependences of transport characteristics have been calculated for PbTe and Bi2Te3 wires at positive and negative polarity of the gate voltage under the assumption that the carrier mobility is similar with the bulk material mobility. Some aspects of microwire fabrication by different methods as well as some general wire characteristics are presented. The first results of experimental measurements of wire transport properties under EFE show the increasing or decreasing of the average Seebeck coefficient in dependence of gate potential polarity in accordance with the theoretical analysis.
  • Keywords
    IV-VI semiconductors; Poisson equation; Seebeck effect; bismuth compounds; lead compounds; nanowires; thermoelectric power; Bi2Te3; PbTe; Poisson equation; average Seebeck coefficient; boundary conditions; carrier mobility; coaxial cylindrical capacitor configuration; cylindrical geometry; cylindrical microwires; electric field effect; gate potential polarity; glass coated microwires; negative polarity; positive polarity; radial dependences; thermopower; Bismuth; Boundary conditions; Capacitors; Coaxial components; Geometry; Glass; Poisson equations; Tellurium; Thermoelectricity; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287520
  • Filename
    1287520