DocumentCode
2831916
Title
Thermal and thermoelectric properties of III-nitride and III-oxynitride films
Author
Izaki, R. ; Iwamura, Y. ; Yamaguchi, S. ; Yamamoto, A.
Author_Institution
Dept. of Electr., Electron. & Inf. Eng., Kanagawa Univ., Yokohama, Japan
fYear
2003
fDate
17-21 Aug. 2003
Firstpage
380
Lastpage
383
Abstract
With the aim of fabricating a thermoelectric power device using III-nitrides (Al1-xInxN, InN and AlN) and III-oxynitrides (Al1-xInxOyNz and InOyNz), we studied their thermal and thermoelectric properties and, in particular, we have focused on their thermal conductivity. Al1-xInxN and Al1-xInxOyNz were prepared by reactive radiofrequency sputtering method. We measured the thermal diffusivity and specific heat using the ac calorimetric method, and we estimated values of the thermal conductivity to be 1.5 W/mK (at 673 K) for Al1-xInxN and 0.8 W/mK (at 673 K) for Al1-xInxOyNz. These values are much smaller than expected considering the large thermal conductivity of nitrides.
Keywords
III-V semiconductors; aluminium compounds; indium compounds; insulating thin films; semiconductor thin films; thermal conductivity; thermal diffusivity; thermoelectricity; wide band gap semiconductors; 673 K; Al1-xInxN; Al1-xInxOyNz; reactive radiofrequency sputtering method; specific heat; thermal conductivity; thermal diffusivity; thermal properties; thermoelectric properties; Choppers; Frequency; Gallium nitride; Gases; Photonic band gap; Semiconductor films; Tellurium; Temperature dependence; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN
0-7803-8301-X
Type
conf
DOI
10.1109/ICT.2003.1287527
Filename
1287527
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