• DocumentCode
    2831916
  • Title

    Thermal and thermoelectric properties of III-nitride and III-oxynitride films

  • Author

    Izaki, R. ; Iwamura, Y. ; Yamaguchi, S. ; Yamamoto, A.

  • Author_Institution
    Dept. of Electr., Electron. & Inf. Eng., Kanagawa Univ., Yokohama, Japan
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    380
  • Lastpage
    383
  • Abstract
    With the aim of fabricating a thermoelectric power device using III-nitrides (Al1-xInxN, InN and AlN) and III-oxynitrides (Al1-xInxOyNz and InOyNz), we studied their thermal and thermoelectric properties and, in particular, we have focused on their thermal conductivity. Al1-xInxN and Al1-xInxOyNz were prepared by reactive radiofrequency sputtering method. We measured the thermal diffusivity and specific heat using the ac calorimetric method, and we estimated values of the thermal conductivity to be 1.5 W/mK (at 673 K) for Al1-xInxN and 0.8 W/mK (at 673 K) for Al1-xInxOyNz. These values are much smaller than expected considering the large thermal conductivity of nitrides.
  • Keywords
    III-V semiconductors; aluminium compounds; indium compounds; insulating thin films; semiconductor thin films; thermal conductivity; thermal diffusivity; thermoelectricity; wide band gap semiconductors; 673 K; Al1-xInxN; Al1-xInxOyNz; reactive radiofrequency sputtering method; specific heat; thermal conductivity; thermal diffusivity; thermal properties; thermoelectric properties; Choppers; Frequency; Gallium nitride; Gases; Photonic band gap; Semiconductor films; Tellurium; Temperature dependence; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287527
  • Filename
    1287527