• DocumentCode
    2831975
  • Title

    Transport properties of polycrystalline Si0.8Ge0.2 thin films for micro power generators

  • Author

    Takashiri, M. ; Borca-Tasciuc, T. ; Olubuyide, O. ; Jacquot, A. ; Hoyt, J. ; Chen, G.

  • Author_Institution
    Dept. of Mech. Eng., MIT, Cambridge, MA, USA
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    395
  • Lastpage
    398
  • Abstract
    The transport properties of polycrystalline Si0.8Ge0.2 thin films are studied for their potential applications in micro power generators. These thin films are deposited by low-pressure chemical deposition (LPCVD). The doping is carried out by boron and phosphorus ion implantation, followed by annealing in nitrogen ambient. The concentration of boron and phosphorus 4.3x1019 cm-3, and 8.7x1019 cm-3, respectively. The thermoelectric transport properties of these thin films are measured, including electrical conductivity, Seebeck coefficient, and thermal conductivity. The electrical conductivity is measured by a 4 point-probe method. The Seebeck coefficient is measured by applying a temperature gradient along the in-plane direction, and evaluating the resulting voltage. The thermal conductivity is measured by a 3ω method in the cross-plane direction.
  • Keywords
    CVD coatings; Ge-Si alloys; Seebeck effect; boron; electrical conductivity; ion implantation; phosphorus; semiconductor thin films; thermal conductivity; thermoelectric conversion; thermoelectricity; LPCVD; Seebeck coefficient; Si0.8Ge0.2:B; Si0.8Ge0.2:P; annealing; doping; electrical conductivity; ion implantation; low-pressure chemical deposition; micro power generators; polycrystalline Si0.8Ge0.2 thin films; temperature gradient; thermal conductivity; transport properties; Boron; Chemicals; Conductivity measurement; Doping; Electric variables measurement; Ion implantation; Power generation; Semiconductor thin films; Sputtering; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287531
  • Filename
    1287531