Lossy transmission line effects in a thin-film multichip module

Author

Sudo, Toshio

Author_Institution

Toshiba Corp., Tokyo, Japan

fYear

1991

fDate

11-14 Jun 1991

Firstpage

2304

Abstract

The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced

Keywords

CMOS integrated circuits; buffer circuits; circuit analysis computing; hybrid integrated circuits; thin film circuits; transmission lines; CMOS interface; CMOS-based multichip modules; MCM; SPICE simulation; chip-on-wafer technology; chip-to-chip signal propagation properties; emitter-coupled logic interface; line resistance; loss transmission line effects; multichip modules; power dissipation; thin-film multichip module; Analytical models; CMOS logic circuits; CMOS technology; Multichip modules; Power dissipation; Power transmission lines; Propagation losses; SPICE; Transistors; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1991., IEEE International Sympoisum on

Print_ISBN

0-7803-0050-5

Type

conf

DOI

10.1109/ISCAS.1991.176838

Filename

176838

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2834594