High speed, high density interconnections for VLSI devices

Author

Ashe, J. ; Tyler, S.G.

Author_Institution

GEC-Marconi Res. Centre, Great Baddow, UK

fYear

1988

fDate

32426

Firstpage

42614

Lastpage

915

Abstract

Illustrates the elements which affect the design of the new generation of packaging and interconnect, and shows the recent progress made in the ESPRIT 958 project on multi-chip modules based on modified printed circuit technology substrates. The paper also compares the electrical characteristics of different process technologies used for the fabrication of high speed, high density interconnection media

Keywords

MMIC; VLSI; packaging; ESPRIT 958 project; electrical characteristics; high density interconnection media; interconnect; modified printed circuit technology substrates; multi-chip modules; packaging;

fLanguage

English

Publisher

iet

Conference_Titel

Manufacturing and Integration Techniques for Microwave Circuits, IEE Colloquium on

Conference_Location

London

Type

conf

Filename

209498

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=283487