DocumentCode
2838284
Title
Structural Robustness Study of a Computer Motherboard
Author
Yating, Yu ; Pingan, Du ; EZhong, Gan
Author_Institution
Univ. Electron. Sci. & Technol. of China, Chengdu
fYear
2006
fDate
15-17 Dec. 2006
Firstpage
2370
Lastpage
2374
Abstract
In this paper, two modal analysis methods are addressed to research the structural robustness of a computer motherboard. One is experimental modal analysis, and the other is computational modal analysis. Experimental modal analysis is carried out by single input multiple output method and the modal parameters of computer motherboard are extracted by multiple reference point modal parameter extraction method in frequency domain. Computational modal analysis is fulfilled by finite element method (FEM). In order to reduce the FE model scale, the locally stiffened regions, such as CPU, PCI sockets, ISA sockets, chipset, memory sockets, were simplified as blocks. The material properties parameters of these regions are measured by electric-test experiments on samples removed from the motherboard. According to finite element (FE) modeling theory, the FE model of the motherboard is constructed, as well as computational modal analysis is performed. By comparison, the result from experimental modal analysis agrees well with those from computational modal analysis. Finally, the underlying resonance regions under different natural frequency are discussed, which will provide some references to optimize and design the structure of the motherboard, as well as to redistribute the components assembled on the motherboard reasonably.
Keywords
finite element analysis; frequency-domain analysis; microcomputers; modal analysis; parameter estimation; CPU; FEM; ISA sockets; PCI sockets; chipset; computational modal analysis; computer motherboard; experimental modal analysis; finite element method; frequency domain; memory sockets; multiple reference point modal parameter extraction method; single input multiple output method; Electric variables measurement; Finite element methods; Frequency domain analysis; Instruction sets; Material properties; Modal analysis; Parameter extraction; Robustness; Semiconductor device measurement; Sockets; computational modal analysis; computer motherboard; experimental modal analysis; structural robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Technology, 2006. ICIT 2006. IEEE International Conference on
Conference_Location
Mumbai
Print_ISBN
1-4244-0726-5
Electronic_ISBN
1-4244-0726-5
Type
conf
DOI
10.1109/ICIT.2006.372636
Filename
4237958
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