DocumentCode
2839218
Title
2004 Proceedings. 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742)
fYear
2004
fDate
24-26 March 2004
Abstract
The following topics are dealt with: interconnection materials; manufacturing and reliability; MEMS and thin films; passives; new technologies; advanced substrate technologies; flip chip and underfills.
Keywords
electronics packaging; MEMS; advanced packaging materials; advanced substrate technologies; flip chip; interconnection materials; manufacturing; new technologies; passives; reliability; thin films; underfills;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Conference_Location
Atlanta, GA, USA
Print_ISBN
0-7803-8436-9
Type
conf
DOI
10.1109/ISAPM.2004.1287976
Filename
1287976
Link To Document