• DocumentCode
    2839533
  • Title

    CMOS photonics™ - SOI learns a new trick

  • Author

    Gunn, Cary

  • Author_Institution
    Luxtera, Inc., Carlsbad, CA, USA
  • fYear
    2005
  • fDate
    3-6 Oct. 2005
  • Firstpage
    7
  • Lastpage
    13
  • Abstract
    Luxtera has used Freescale Semiconductor´s production 0.13μm SOI process to implement optical communications capability for high bandwidth LAN, SAN, shelf-to-shelf and chip-to-chip communications. These optical transceiver cores operate at 10Gbps and offer superior reach, power consumption, latency, die area, and scalability compared to emerging standards for electrical interconnect. They are monolithically fabricated alongside SOI CMOS circuitry in the same die. Thus, for the first time in history, high speed optical communications directly between silicon die can be accomplished at a price/performance point superior to traditional electrical interconnect.
  • Keywords
    CMOS integrated circuits; integrated optoelectronics; optical communication; optical interconnections; optical receivers; optical transmitters; optical waveguides; silicon-on-insulator; 0.13 micron; 10 Gbit/s; CMOS photonics; SOI CMOS circuit; chip-to-chip communications; electrical interconnect; high speed optical communications; optical transceiver cores; shelf-to-shelf communications; silicon die; Bandwidth; Energy consumption; High speed optical techniques; Integrated circuit interconnections; Local area networks; Optical fiber communication; Optical interconnections; Production; Storage area networks; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2005. Proceedings. 2005 IEEE International
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-9212-4
  • Type

    conf

  • DOI
    10.1109/SOI.2005.1563518
  • Filename
    1563518