DocumentCode
2839533
Title
CMOS photonics™ - SOI learns a new trick
Author
Gunn, Cary
Author_Institution
Luxtera, Inc., Carlsbad, CA, USA
fYear
2005
fDate
3-6 Oct. 2005
Firstpage
7
Lastpage
13
Abstract
Luxtera has used Freescale Semiconductor´s production 0.13μm SOI process to implement optical communications capability for high bandwidth LAN, SAN, shelf-to-shelf and chip-to-chip communications. These optical transceiver cores operate at 10Gbps and offer superior reach, power consumption, latency, die area, and scalability compared to emerging standards for electrical interconnect. They are monolithically fabricated alongside SOI CMOS circuitry in the same die. Thus, for the first time in history, high speed optical communications directly between silicon die can be accomplished at a price/performance point superior to traditional electrical interconnect.
Keywords
CMOS integrated circuits; integrated optoelectronics; optical communication; optical interconnections; optical receivers; optical transmitters; optical waveguides; silicon-on-insulator; 0.13 micron; 10 Gbit/s; CMOS photonics; SOI CMOS circuit; chip-to-chip communications; electrical interconnect; high speed optical communications; optical transceiver cores; shelf-to-shelf communications; silicon die; Bandwidth; Energy consumption; High speed optical techniques; Integrated circuit interconnections; Local area networks; Optical fiber communication; Optical interconnections; Production; Storage area networks; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2005. Proceedings. 2005 IEEE International
ISSN
1078-621X
Print_ISBN
0-7803-9212-4
Type
conf
DOI
10.1109/SOI.2005.1563518
Filename
1563518
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