DocumentCode
2839631
Title
Epoxy-based optically transparent nanocomposites for photonic packaging
Author
Zhou, Yan ; Shi, Frank G.
Author_Institution
Optoelectronics Packaging & Integration Lab., California Univ., Irvine, CA, USA
fYear
2004
fDate
2004
Firstpage
100
Lastpage
102
Abstract
A new optically transparent nanocomposite for photonic packaging and device applications is introduced. The effect of filler particle fraction on the coefficient of thermal expansion (CTE), fracture toughness, and light transmittance of epoxy based optical nanocomposite materials is studied. A nanometer-order silica filler is incorporated into an epoxy matrix with different fractions. The CTE, fracture toughness, and light transmittance at a wavelength range from 300 to 900 nm are measured. The relationship between the measured properties and the filler content is discussed. It is found, as expected, that with the same particle size, increasing the filler fraction results in a decreased CTE and an increased fracture toughness. Actually, the fracture toughness of the nano system is about 10% higher than that of the system with micron-sized fillers at 20% filler loadings. The light transmittance decreases initially with the addition of fillers but there exists a 10% critical filler content above which the further addition of fillers up to 24% does not lead to any further reduction of light transmittance.
Keywords
filled polymers; fracture toughness; nanoparticles; plastic packaging; silicon compounds; thermal expansion; transparency; 300 to 900 nm; CTE; SiO2; coefficient of thermal expansion; epoxy matrix; epoxy-based nanocomposites; filler loading; filler particle fraction; filler particle size; fracture toughness; light transmittance; optically transparent nanocomposites; photonic packaging; silica filler; Nanocomposites; Optical devices; Optical materials; Optical mixing; Optical polymers; Optical refraction; Optical variables control; Packaging; Silicon compounds; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Print_ISBN
0-7803-8436-9
Type
conf
DOI
10.1109/ISAPM.2004.1287997
Filename
1287997
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