Investigations of adhesion between Cu and Benzocyclobutene (BCB) polymer dielectric for 3D integration applications

Author

Huang, W.C. ; Ko, C.T. ; Hu, S.H. ; Leu, J. ; Chen, K.N.

Author_Institution

Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

fYear

2011

fDate

19-21 Oct. 2011

Firstpage

363

Lastpage

365

Abstract

In this paper, the adhesion strength between Cu metal and Benzocyclobutene (BCB) polymer dielectric was investigated and reported. The relation between the adhesion strength and thickness of metal layer and the relation between the adhesion strength and stacking order of copper and BCB polymer layer are discussed as well. Finally, the concept of an extra layer between Cu metal and BCB polymer layer to improve the adhesion strength was evaluated. The results of this research can provide important guidelines of hybrid bonding and underfill for 3D integration applications.

Keywords

adhesion; adhesive bonding; copper; integrated circuit interconnections; polymers; three-dimensional integrated circuits; 3D integration applications; BCB; Cu; adhesion strength; benzocyclobutene polymer dielectric; hybrid bonding; metal layer thickness; stacking order; Adhesives; Copper; Polymers; Silicon; Stacking; Three dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4577-1387-3

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2011.6117239

Filename

6117239