DocumentCode
2842763
Title
Transition structures for EBG waveguide-based interconnects
Author
Suntives, Asanee ; Abhari, Ramesh
Author_Institution
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
fYear
2005
fDate
24-26 Oct. 2005
Firstpage
147
Lastpage
150
Abstract
In this paper, transition structures are investigated for coplanar and 3D integration of EBG-based waveguides. These waveguide-type interconnects find application in modern high-speed/high-frequency system packaging. The design of each transition follows a parametric fullwave simulation scheme to optimize the matching within the widest possible bandwidth.
Keywords
coplanar waveguides; integrated circuit interconnections; integrated circuit packaging; photonic band gap; waveguide transitions; EBG waveguide-based interconnects; parametric fullwave simulation scheme; system packaging; transition structures; Coplanar waveguides; Dielectric losses; Dielectric substrates; Electromagnetic waveguides; Integrated circuit interconnections; Metamaterials; Microstrip; Periodic structures; Planar waveguides; Waveguide transitions;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN
0-7803-9220-5
Type
conf
DOI
10.1109/EPEP.2005.1563723
Filename
1563723
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