Investigation of lead frame package interconnection for mm-wave balanced circuit

Author

Ito, Ryosuke

Author_Institution

M/A-COM Inc., Lowell, MA, USA

fYear

2005

fDate

24-26 Oct. 2005

Firstpage

159

Lastpage

162

Abstract

Differential SiGe circuit has been gaining popularity for low-cost mm-wave circuit. Plastic lead frame packages are believed to suit for device packaging for such low-cost system. In this paper, the design factors in the lead frame package interconnection for differential circuit that influence electrical performance are qualitatively investigated by numerical modeling. The results show certain factors affect differential mode insertion loss and/or common mode isolation.

Keywords

Ge-Si alloys; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; millimetre wave integrated circuits; plastic packaging; SiGe; common mode isolation; device packaging; differential SiGe circuit; differential mode insertion loss; electrical performance; lead frame package interconnection; mm-wave balanced circuit; numerical modeling; plastic lead frame packages; Bonding; Electronics packaging; Feeds; Germanium silicon alloys; Impedance matching; Integrated circuit interconnections; Microstrip; Plastic packaging; Semiconductor device packaging; Silicon germanium;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on

Print_ISBN

0-7803-9220-5

Type

conf

DOI

10.1109/EPEP.2005.1563726

Filename

1563726