DocumentCode
2842838
Title
On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction
Author
Singh, A.D. ; Krishna, C.M.
fYear
1991
fDate
26-30 Oct 1991
Firstpage
228
Keywords
Hardware; Manufacturing; Production; Proposals; Semiconductor device manufacture; Semiconductor device measurement; Semiconductor device testing; Statistical analysis; Very large scale integration; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1991, Proceedings., International
ISSN
1089-3539
Print_ISBN
0-8186-9156-5
Type
conf
DOI
10.1109/TEST.1991.519514
Filename
519514
Link To Document