DocumentCode
2842839
Title
SLA-driven applicability analysis for patch management
Author
Yang, Bo ; Zeng, Sai ; Ayachitula, Naga ; Puri, Rajeev
Author_Institution
Dept. of Distrib. Comput., IBM Res. - China, Beijing, China
fYear
2011
fDate
23-27 May 2011
Firstpage
438
Lastpage
445
Abstract
To strengthen patch management, organizations are required not only to focus on sole patch management on single server, machine or application servers, but also to consider other IT system management processes as well because patch management relies on them to be efficient. Processes such as inventory, system configurations, risk management, change management, system audit, and business cost on policy and SLA should be evaluated and enhanced together with patch management; appropriate applicability assessment of patch should be built in and coordinated with all these processes to make patch management a safe, reliable and efficient process to carry out its high profile tasks. This paper presents a patch management framework based on SLA-driven patch applicability analysis. It provides automatic patch applicability analysis and risk assessment for supporting business-impact analysis and logical control during patch process. Experimental results collected from the simulation on realistic business services case study show that SLA-driven patch applicability analysis based patch management outperforms traditional patch management.
Keywords
business data processing; information management; risk management; software maintenance; software management; IT system management processes; SLA-driven applicability analysis; applicability assessment; automatic patch applicability analysis; business cost; business services; business-impact analysis; change management; logical control; patch management; risk management; system audit; Business; Grippers; Monitoring; Planning; Security; IT Service Management; SLA; business impact analysis; patch management;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Network Management (IM), 2011 IFIP/IEEE International Symposium on
Conference_Location
Dublin
Print_ISBN
978-1-4244-9219-0
Electronic_ISBN
978-1-4244-9220-6
Type
conf
DOI
10.1109/INM.2011.5990544
Filename
5990544
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