• DocumentCode
    2846091
  • Title

    Thermal acceleration of compound semiconductors in humidity

  • Author

    Roesch, William J.

  • fYear
    2005
  • fDate
    Oct. 30, 2005
  • Firstpage
    111
  • Lastpage
    121
  • Keywords
    Acceleration; Failure analysis; Humidity; Life estimation; Life testing; Moisture; Packaging; Plastics; Semiconductor device testing; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ROCS Workshop, 2005. [Reliability of Compound Semiconductors]
  • Print_ISBN
    0-7908-0106-X
  • Type

    conf

  • DOI
    10.1109/ROCS.2005.201557
  • Filename
    1563941
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2846091