DocumentCode
2848953
Title
Degradation mechanism of dielectric properties of HfO due to interaction of oxygen composition and strain
Author
Suzuki, K. ; Ito, Y. ; Ito, H. ; Miura, H.
Author_Institution
Tohoku Univ., Sendai
fYear
2007
fDate
23-25 April 2007
Firstpage
1
Lastpage
2
Abstract
This paper reports on a quantum chemical molecular dynamics analysis for HfO2 film with different amount of oxygen in order to make clear the effect of the strain and intrinsic defects in the film on the dielectric characteristic of the hafnium dioxide film. When an oxygen vacancy or a carbon atom as the impurity is introduced in HfO2 film, a donor site is formed locally around the vacancy or carbon atom. On the other hand, it has been found that an acceptor site is formed when an excess oxygen atom is added to the film. The magnitude of the band gap of the HfO2plusmnx decreases drastically from 5.6 eV to about 0.1 eV. Uni-axial strain causes anisotropic change of the band structure of HfO2. The change rate of the band gap due to the uni-axial strain is about 10% /10%-strain.
Keywords
dielectric thin films; energy gap; hafnium compounds; impurity states; internal stresses; molecular dynamics method; vacancies (crystal); HfO2; band gap; band structure; dielectric thin films; intrinsic defects; oxygen vacancy; quantum chemical molecular dynamics analysis; uniaxial strain; Capacitive sensors; Chemical analysis; Degradation; Dielectric films; Fluctuations; Hafnium oxide; Indium tin oxide; Mechanical factors; Photonic band gap; Tensile strain;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems and Applications, 2007. VLSI-TSA 2007. International Symposium on
Conference_Location
Hsinchu
ISSN
1524-766X
Print_ISBN
1-4244-0584-X
Electronic_ISBN
1524-766X
Type
conf
DOI
10.1109/VTSA.2007.378911
Filename
4239479
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