DocumentCode
2848988
Title
Design and simulation of SIP for RF system
Author
Lin-Tao, Liu ; Ming-yan, Yu ; Yi-zheng, Ye ; Jin-xiang, Wang
Author_Institution
Microelectron. Center, Harbin Inst. of Technol., China
fYear
2005
fDate
30 Aug.-2 Sept. 2005
Firstpage
102
Lastpage
104
Abstract
With the scaling of CMOS, the system-on-chip (SOC) has become a viable option for RF system. The absence of high Q inductors for CMOS RF has led to an appearance of RF system-in-package. In this paper, we analyze the merit of the package for CMOS RF IC and review development of the package. We focus on LTCC technology and simulate a high performance mixer using stacked spiral inductor.
Keywords
CMOS integrated circuits; ceramic packaging; inductors; mixers (circuits); radiofrequency integrated circuits; system-in-package; CMOS RFIC; LTCC technology; RF system-in-package; mixer; stacked spiral inductor; system-on-chip; CMOS integrated circuits; CMOS technology; Inductors; Integrated circuit interconnections; Integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; Silicon; System-on-a-chip; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2005 6th International Conference on
Print_ISBN
0-7803-9449-6
Type
conf
DOI
10.1109/ICEPT.2005.1564640
Filename
1564640
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