Experiment study of temperature parameter effect on bonding process and quality in thermosonic wire bonding

Author

Zhili, Long ; Lei, Han ; Yunxin, Wu ; Jue, Zhong

Author_Institution

Coll. of Electromech. Eng., Central South Univ., Changsha, China

fYear

2005

fDate

30 Aug.-2 Sept. 2005

Firstpage

408

Lastpage

413

Abstract

An experiment study of temperature parameter on bonding process and bonding quality in thermosonic wire bonding was performed in this paper. The experiment method was based on changing regularly bonding temperature and gaining the bonding strength by shearing gold ball joint by a high precision gauge. The experiment results and analysis can find out the relationship of bonding temperature and bonding strength, and get the temperature ultimate, favorite temperature window and bondability window at that bonding condition. Moreover, the experiment can find that the effect of temperature on impedance and power of PZT transducer in bonding process. These experiment phenomena and analysis results can be help to research on bonding parameters matching and optimization in thermosonic wire bonding.

Keywords

lead bonding; piezoelectric transducers; PZT transducer; bonding process; bonding quality; bonding strength; bonding temperature; high precision gauge; temperature parameter effect; thermosonic wire bonding; Bonding processes; Current measurement; Gold; Impedance; Integrated circuit modeling; Packaging; Temperature; Transducers; Voltage; Wire; Bonding strength; Bonding temperature; Impedance of PZT transduecr; Power of PZT transducer; Thermosonic wire bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2005 6th International Conference on

Print_ISBN

0-7803-9449-6

Type

conf

DOI

10.1109/ICEPT.2005.1564744

Filename

1564744