• DocumentCode
    2850689
  • Title

    Design and simulation of THz filters embedded in LTCC multi-layer substrate

  • Author

    Miao, Min ; Zhang, Xiaoqing ; Zhang, Yang ; Xu, Shufang ; Liang, Lei ; Li, Zhensong

  • Author_Institution
    Inf. Microsyst. Inst., Beijing Inf. Sci. & Technol. Univ., Beijing, China
  • fYear
    2011
  • fDate
    17-18 Nov. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    THz (Terahertz) technology has made great strides; however, publications on millimeter wave and THz passives, such as filters, are somewhat few by now. This paper proposes design of THz filters based on substrate integrated waveguide (SIW) and cavities implemented by micromachining of low-temperature co-fired ceramic (LTCC) multilayer substrate and utilizes SIW rectangular coupling cavity filter and cylindrical cavity coupling filter mechanism. The filters are embedded in a multi-layer LTCC substrate, and are validated with a finite element full-wave simulation tool. With mid-band frequency set to frequencies in THz bands, both filters demonstrate excellent return loss in stopband and insertion loss in passband; furthermore they are shown promising in combining vacuum microelectronics into highly integrated 3D Microsystem-in-packages.
  • Keywords
    band-pass filters; band-stop filters; ceramics; finite element analysis; micromachining; submillimetre wave filters; substrate integrated waveguides; vacuum microelectronics; waveguide filters; 3D microsystem-in-packages; LTCC multilayer substrate; SIW rectangular coupling cavity filter; THz bands; THz filters; THz passives; THz technology; cylindrical cavity coupling filter mechanism; finite element full-wave simulation tool; insertion loss; low-temperature co-fired ceramic multilayer substrate; micromachining; mid-band frequency; millimeter wave passives; multilayer LTCC substrate; passband; return loss; stopband; substrate integrated waveguide; terahertz technology; vacuum microelectronics; Band pass filters; Cavity resonators; Couplings; Filtering theory; Micromachining; Substrates; Three dimensional displays; Low temperature co-fired ceramic; filter; micromachining; substrate integrated waveguide; terahertz; vacuum microelectronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2011 International Conference of
  • Conference_Location
    Tianjin
  • ISSN
    Pending
  • Print_ISBN
    978-1-4577-1998-1
  • Electronic_ISBN
    Pending
  • Type

    conf

  • DOI
    10.1109/EDSSC.2011.6117678
  • Filename
    6117678