DocumentCode
2850689
Title
Design and simulation of THz filters embedded in LTCC multi-layer substrate
Author
Miao, Min ; Zhang, Xiaoqing ; Zhang, Yang ; Xu, Shufang ; Liang, Lei ; Li, Zhensong
Author_Institution
Inf. Microsyst. Inst., Beijing Inf. Sci. & Technol. Univ., Beijing, China
fYear
2011
fDate
17-18 Nov. 2011
Firstpage
1
Lastpage
2
Abstract
THz (Terahertz) technology has made great strides; however, publications on millimeter wave and THz passives, such as filters, are somewhat few by now. This paper proposes design of THz filters based on substrate integrated waveguide (SIW) and cavities implemented by micromachining of low-temperature co-fired ceramic (LTCC) multilayer substrate and utilizes SIW rectangular coupling cavity filter and cylindrical cavity coupling filter mechanism. The filters are embedded in a multi-layer LTCC substrate, and are validated with a finite element full-wave simulation tool. With mid-band frequency set to frequencies in THz bands, both filters demonstrate excellent return loss in stopband and insertion loss in passband; furthermore they are shown promising in combining vacuum microelectronics into highly integrated 3D Microsystem-in-packages.
Keywords
band-pass filters; band-stop filters; ceramics; finite element analysis; micromachining; submillimetre wave filters; substrate integrated waveguides; vacuum microelectronics; waveguide filters; 3D microsystem-in-packages; LTCC multilayer substrate; SIW rectangular coupling cavity filter; THz bands; THz filters; THz passives; THz technology; cylindrical cavity coupling filter mechanism; finite element full-wave simulation tool; insertion loss; low-temperature co-fired ceramic multilayer substrate; micromachining; mid-band frequency; millimeter wave passives; multilayer LTCC substrate; passband; return loss; stopband; substrate integrated waveguide; terahertz technology; vacuum microelectronics; Band pass filters; Cavity resonators; Couplings; Filtering theory; Micromachining; Substrates; Three dimensional displays; Low temperature co-fired ceramic; filter; micromachining; substrate integrated waveguide; terahertz; vacuum microelectronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits (EDSSC), 2011 International Conference of
Conference_Location
Tianjin
ISSN
Pending
Print_ISBN
978-1-4577-1998-1
Electronic_ISBN
Pending
Type
conf
DOI
10.1109/EDSSC.2011.6117678
Filename
6117678
Link To Document